Tintronics tins critical parts including Fine Pitch QFPs, LCCs, PLCCs, DIPs, SIPs, TO Cans, connectors, and axial and radial components. Our services include hot solder dip of all through-hole and SMT devices, Mil-Spec, lead-free, tin mitigation, high-temperature and exotic metals processing.

The next time your organization needs component lead forming, tinning, tape and reel packaging or BGA balling, contact Tintronics. We’d like to show you how our edge can get you to market sooner, and keep returns and rejects away from your door.

We have the expertise and precise tooling to form leads to the highest specifications.

Tintronics’ tape-and-reel packaging delivers your parts the way you need them.

Our state-of-the-art Ball Grid Array (BGA) reflow process provides the precise controls needed for balling or re-balling most ceramic and non-ceramic components.