TINTRONICS | Veteran Owned and Operated
ISO 9001:2008AS9100 REV CTintrac

Ball grid array ballings are manufactured in a rapid, state-of-the-art process

Here at Tintronics Industries, we don't dabble in state-of-the-art connectivity, we embody it. Our location in Huntsville, Alabama, is delivering some of the most innovative configurations in high-tech circuitry imaginable.

One striking example of our commitment to state-of-the-art is our ability to rapidly rework and/or repair ball grid array (BGA). In today's high-performance world of electronic circuitry, where there's an ever-growing demand for greater levels of soldered circuitry per square unit of circuit board, BGA's are an industry game-changer. With our ability to perform work on varying package sizes, Tintronics is a game-changing MVP.

We have the ability to work with either ceramic or plastic packages, various pitches, as well as straight and complex sphere patterns. We feature lead-free to lead alloy conversion and vice-versa, as well as the ability to convert land grid arrays (LGA) into BGA configurations.

Tintronics is capable of achieving low-volume or high-volume production, with typical lead times   of 1-2 weeks (though emergency rush services are available). We deliver precise products efficiently to clients ranging from aerospace to industrial to communications.

For further information about Tintronics and what we do, contact us today or keep browsing our website.

Ball grid array ballings are manufactured in a rapid, state-of-the-art process

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BGA Reball and Repair Services

Ball Grid Array Capabilities
BGA balling
Rework
Repair
Package Width 1 to 47 mm
Package Length 1.45 to 47 mm
Sphere Diameter .010 to .035 mm
Sphere Pitch .5 to 1.5 mm
Pattern Straight rows
Complex
Alloys
Sn10 Pb90
Sn63 Pb37
Sn96.5 Ag3 Cu.5
Alloy Conversion Lead to lead-free
Lead-free to lead
Package Ceramic
Plastic
Converting Land grid arrays (LGA) to ball grid array (BGA)
Packaging
Tape and reel
Tray
Custom
Process Control
Multi-stage convection/conduction oven
4 heating zones
2 cooling zones
Maximum Substrate Size 5 x 5.75 in
Speed 3 to 50 in/min
Time 1 sec to 99:59 min per zone
Temperature Up to 400 °C
Temperature Accuracy +/- 2 °C
O2 Level 10 ppm
Additional Services
Solderability Testing
Cleanliness Testing
Baking and Dry Packaging
Sphere attachment to LGA & DFN
Industry Focus
Aerospace
Industrial
Scientific
Military
Medical
Communication
Energy
Industry Standards
ISO 9001:2008
NASA-STD-8739.2
NASA-STD-8739.3
J-STD-001 (Space Application Addendum)
MIL Std. 2000
J-STD-002/004/006/033
ANSI-2020
Mil-I-45208
AS 9001 REV C
GEIA-0006
Compliance
RoHS
ITAR
REACH
Production Volume Low Volume / High Mix
High Volume
Typical Lead Times Available 2 weeks
Emergency Services Available

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