TINTRONICS | Veteran Owned and Operated
ISO 9001:2008AS9100 REV CTintrac

Hot Solder Dip & Custom Tinning Services

Though hot solder dip tinning has always been one of the mainstays of the electronics industry, Tintronics Industries has that process perfected down to a science. By way of hot solder dipping and automation capabilities such as robotic load/unload/transfer and auto flux, we can rapidly tin products running the spectrum of electronic components, including mechanical devices such as connectors and test points.

From pre-heat to post-dip, we can easily reach production levels of high or low-volume with 1-2 weeks lead time (though emergency rush services are available). For further information about Tintronics and what we do, contact us today or keep browsing our website.

Custom Tinning Services

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Hot Solder Dip/Custom Tinning Capabilities:

Products
QFP
CLCC
PLCC
Thru-hole
Connectors
DIP
SIP
SOIC
LCC
DFN
QFN
SOD
SOT
Alloys
Sn63 Pb37
Sn5 Pb93.5 Ag1.5
SAC305 ( Sn96.5 Ag3.0 Cu.5)
Sn96.5 Ag3.5
Specialty alloys quoted upon request
Processes Hot Solder Dipping
Handling Capabilities
Reel
Tube
Tray
Bulk
In any combination
Automation Capabilities
Robotic Load/Unload/Transfer
Computer Controlled Process
Solder/Preheat Temperature Controlled
Auto Flux
Auto Wash
Predip Operations Preheated
Flux
Postdip Operations
Cooldown
Washing
Drying
Unload
Testing Ability Solderability Testing
Cleanliness Testing
Pitch .4 mm
Solder Thickness 10 microns
Packaging Tape and Reel
Tray
Custom
Additional Services Baking and Dry Packaging
Industry Focus
Aerospace
Industrial
Scientific
Military
Medical
Communication
Energy
Industry Standards
ISO 9001:2008
NASA-STD-8739.2
NASA-STD-8739.3
J-STD-001 (Space Application Addendum)
MIL Std. 2000
J-STD-002/004/006/033
ANSI-2020
Mil-I-45208
AS 9001 REV C
GEIA-0006
Compliance
RoHS
ITAR
REACH
Production Volume Low Volume / High Mix
High Volume
Typical Lead Times Available 2 weeks
Emergency Services Available

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