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Hot Solder Dip of a QFN chip for the Military Industry

Tintronics used an automated/robotic hot solder dip station to apply a hot solder tinning dip to a QFN chip, which is used in a military radio frequency application for the defense industry. The company used Sn63 Pb37 solder and ORH1 flux and ground the plane co-planarity down to .002”. Inspection/lead scanning as well as visual and final inspections were also completed. The application meets the defense customer’s specifications, as well as ANSI/ESD S20.20-2007, IPC J-STD-001E-2010 and IPC/JEDEC J-STD-033B.1 standards on the low-volume production runs. Hot Solder Dip of a QFN chip for the Military Industry

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Specifications about this QFN Chip for the Military

Product Description This QFN power amplifier is used within a radio frequency application
Capabilities Applied/Processes
Primary:
Tinning
Secondary:
Inspection/Lead Scanning
Equipment Used to Tin Part Automated/Robotic Hot Solder Dip Station
Tightest Tolerances Ground plane coplanarity down to .002
Material Used Sn63 Pb37 Solder
ORH1 Flux
In process testing performed Visual Inspection
Final Inspection
Industry for Use Defense
Quantity Low volume
Standards Met
Customer supplied specifications
ANSI/ESD S20.20-2007
IPC J-STD-001E-2010
IPC/JEDEC J-STD-033B.1
Project Name Hot Solder Dip of a QFN

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