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Hot Solder Dip of a QFN chip for the Military Industry

Tintronics used an automated/robotic hot solder dip station to apply a hot solder tinning dip to a QFN chip, which is used in a military radio frequency application for the defense industry. The company used Sn63 Pb37 solder and ORH1 flux and ground the plane co-planarity down to .002”. Inspection/lead scanning as well as visual and final inspections were also completed. The application meets the defense customer’s specifications, as well as ANSI/ESD S20.20 IPC J-STD-001 and IPC/JEDEC J-STD-033 standards on the low-volume production runs. Hot Solder Dip of a QFN chip for the Military Industry

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Specifications about this QFN Chip for the Military

Product Description This QFN power amplifier is used within a radio frequency application
Capabilities Applied/Processes
Primary:
Tinning
Secondary:
Inspection/Lead Scanning
Equipment Used to Tin Part Automated/Robotic Hot Solder Dip Station
Tightest Tolerances Ground plane coplanarity down to .002
Material Used Sn63 Pb37 Solder
J-STD-004
In process testing performed Visual Inspection
Final Inspection
Industry for Use Defense
Quantity Low volume
Standards Met
Customer supplied specifications
ANSI/ESD S20.20
IPC J-STD-001
IPC/JEDEC J-STD-033
Project Name Hot Solder Dip of a QFN

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