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Call:
256.650.0220
Email:
sales@tintronics.com
Services
Hot Solder Dip
BGA Reball and Repair
Tape & Reel Packaging
Precision Lead Forming
Portfolios
Hot Solder Dip of a
QFN Chip
PCB Connect Point in
SMT Carrier
J-Lead Forming of a
MOSFET Transistor
Wire Strip/Trim and
Lead-free Solder Dip of
RFI Filter
Leading the Way
Since 1988
,
Technology, Innovation, Service & Value
Hot Solder Dip
BGA Reball and Repair
Tape & Reel Packaging
Precision Lead Forming
View Examples of our Portfolios >>
DFN
Tinning
Through Hole
in SMT Tape
Through Hole
to J-Lead Form
Wire Trim and HSD
No-Lead Solder
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