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Hot Solder Dip of a QFN chip for the Military Industry

Hot Solder Dip of a QFN Chip

Tintronics used an automated/robotic hot solder dip station to apply a hot solder tinning dip to a QFN chip, which is used in a military radio frequency application for the defense industry. The company used Sn63 Pb37 solder and ORH1 flux and ground the plane co-planarity down to .002”. Inspection/lead scanning as well as visual and final inspections were also completed. The application meets the defense customer’s specifications, as well as ANSI/ESD S20.20 IPC J-STD-001 and IPC/JEDEC J-STD-033 standards on the low-volume production runs.

Specifications about this QFN Chip for the Military

Product Description This QFN power amplifier is used within a radio frequency application
Capabilities Applied/Processes Primary:
Inspection/Lead Scanning
Equipment Used to Tin PartAutomated/Robotic Hot Solder Dip Station
Tightest TolerancesGround plane coplanarity down to .002
Material UsedSn63 Pb37 Solder
In process testing performedVisual Inspection
Final Inspection
Industry for UseDefense
QuantityLow volume
Standards MetCustomer supplied specifications
Project NameHot Solder Dip of a QFN