Tintronics completed the J-lead Forming of a MOSFET transistor, which is used in a high-efficiency switching application for a military client. The company employed a custom-designed forming die, a bench-top lead form press and a manual hot solder dip station. The parts meet tight tolerances of .161” ±.010” from the lead exit to the inside bend and .050” ±.030” on the radius. The primary processes, lead forming and tinning, and the secondary processes, lead scanning and visual and final inspections, ensured the parts met the customer-supplied specifications as well as the IPC J-STD-001, IPC/JEDEC J-STD-033B.1 and ANSI/ESD S20.20 standards. The production runs were low-volume.