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Precision Lead Forming Services

Precision Lead Forming Services

Precision Lead Forming , whether by surface mount or by through-hole, is one of the key processes by which high-performance circuitry is able to maintain functionality in this day and era. Tintronics Industries is keenly aware that today’s circuit boards and machinery have advanced astronomically since the early days of personal computers and flat ribbon cables. We have truly entered a new age of dynamic flexibility whose twists and turns take time to master. Our ability to twist and turn surface mounts into through-holes, through-holes into surface mounts, and pretty much custom-configure any given lead, more than proves our mastery.

We can easily reach production levels of high or low-volume (though expedite services are available). For further information about Tintronics and what we do, contact us today or keep browsing our website.

Tintronics Precision Lead Forming Capabilities

Lead Forming Devices Surface Mount
Through-Hole
Lead Forming Configurations Surface Mount to Through-Hole
Through-Hole to Surface Mount
Customized Form Requirements
Lead Thickness.040 in
Pitch.4 mm
Inspection MethodsOptical Comparator
3-D Vision System (Automatic & Manual)
CapabilitiesIn-House Tool Design & Manufacture
Custom Packages and Trays
Process Controls
Automatic & Manual
Computerized Optical Scanning MetricsCoplanarity
Sweep
Pitch
Tip to Tip
Co-ServicingTinning
Tape and Reel
Custom Packaging
Additional ServicesSolderability Testing
Cleanliness Testing
Baking and Dry Packaging
Industry FocusAerospace
Industrial
Scientific
Military
Medical
Communication
Energy
Industry StandardsISO 9001
NASA-STD-8739.2
NASA-STD-8739.3
J-STD-001 (Space and Military Addendum)
MIL Std. 2000
J-STD-002/004/006/033
ANSI/ESD S20.20
Mil-I-45208
AS 9001
GEIA-0006
ComplianceRoHS
ITAR
REACH
Conflict Minerals
Production VolumeLow Volume / High Mix
High Volume
Typical Lead Times Available4-8 weeks
Expedite Services Available